본문 바로가기

반도체 공정& 소자/Etching4

Undercut profile of ER in nanofabrication Lift off using (single layer) negative resist is very challenging for two reasons. The resist profile is tapered with wider opening due to electron forward scattering, which leads to film coating on the side wall and thus makes a clean lift off difficult. Common negative resists such as polystyrene and SU-8 becomes cross-linked and insoluble upon exposure, and thus a strong chemical must be used.. 2023. 5. 16.
반도체 공정 Outline 1. Photolithography Photolithographic Process (노광공정) 노광공정은 크게 다음의 과정을 합친것을 총칭한다. Cleaning wafers → Depositing barrier layer → Coating with photoresist → Soft baking → Aligning masks → Exposing pattern → Developing photoresists → Hard baking → Etching spin-current.tistory.com ThinFilm DMI Etch Implant Cleaning&CMP PTE 하나씩 알아가볼 예정입니다. 2022. 6. 22.
Introduction to Electron Beam Lithography (EBL) 참고문헌[1] Encyclopedia of Nanotechnolgy[2] Nanofabrication Using Electron Beam Lithography: Novel Resist and Applications, Arwa Abbas[3] UC Berkeley Marvell Nanofabrication Laboratory[4] Process Optimization on Raith-150 TWO E-Beam Lithography Tool for sub-100nm CMOS device fabrication  0. DefinitionEBL은 패터닝을 하는데 있어 기존의 포토리소그래피 처럼 광자를 사용하는 것이 아니라, 전자를 사용하는 기법이다. EBL은 포토리소그래피와 여러면에서 유사점을 갖고 있으며, 아래.. 2021. 8. 25.
Lithography - Etching Techniques What is Etching? : Chemical etching in liquid or gaseous form is used to remove any barrier material not protected by photoresist. Figure of Merit/ Factors affecting etch quality 1. Selectivity 얼마나 특정 물질만 선택적으로 Etching 할 수 있는가? $ Selectivity = \cfrac{Etch\, rate\, of\, material\, to\, be\, etched}{Etch\, rate\, of\, material\, not\, to\, be\, etched} $ 2. Isotropy vs Anisotropy 3. Etch rate The .. 2021. 7. 19.

티스토리툴바