GAA2 외벽 포크시트 해당 글은 imec의 Outer wall forksheet to bridge nanosheet and CFET device architectures in the logic technology roadmap 게시물을 번역한 글입니다.ReferencesEntering the nanosheet transistor era, imec Reading RoomStacked nanosheet fork architecture for SRAM design and device co-optimization toward 3nm, P. Weckx et al, IEDM 2017Novel forksheet device architecture as ultimate logic scaling device towards 2nm, P. We.. 2026. 6. 10. 차세대 3D NAND 플래시를 위한 z-피치 스케일링 해당 글은 imec에 올라온 Unlocking z-pitch scaling for next-generation 3D NAND flash 을 번역한 것입니다.ReferencesSK hynix Starts Mass Production of World's First 321-High NAND spectrum.ieee.org/flash-memoryA confined storage nitride 3D-NAND cell with WL airgap for cell-to-cell interference reduction and improved program performances, D. Resnati, 2024 VLSIHole-side airgap integration as enabler for 3D NAND flash.. 2026. 6. 9. 이전 1 다음
